Kinsus Interconnect Technology Corp. (Taiwan, China)

Founded on 11th September 2000, Kinsus Interconnect Technology Corp. is mainly engaged in the manufacture of ball-shaped grid array (BGA) substrates in integrated circuits. Major business includes electronic components manufacturing, wholesale electronic materials, electronic materials retail and business management consulting. In July 2001, the company obtained QS9000 certification, and then in December, got the ISO-14000 environmental certification. Company issued public offering in June 2003. Plant was expanded with Building 3 and Building. Pinoff Company is KINSUS CORP. (USA), of which Kinsus Interconnect Technology Corp. holds 100% shares. The company plans to develop new products. They are design services of BGA carrier board layout for customers to use in the design phase, no wire cooling BGA carrier including high-density I/O chips or ASIC chips, multi-chip MCM carrier board supporting graphics chip and memory chip All-In-One design requirements, CSP (ChipScalePackage) and MicroBGA for future phone chips, RFMoudle, PTP (Paper Thin Package), design requirements for flip-chip carrier board FCBGA-3D graphics, CPU, chipset, high-end network design chips 1000I / O and over, and SiP (System in Package) technology Support to provide total solution for wireless communications products designing.