Nepes Advanced Materials Corporation is engaged in providing advanced materials in the field of IT parts and Electronic Materials. The company offers epoxy molding compound, printable die attach adhesive, underfill resin for COF, clear molding compound, white epoxy molding compound, silicone encapsulant, W-EMC mold lead frame, adhesive, photoimageable solder resists and lens for LCD, BLU, TV and Lighting. Nepes Advanced Materials Corporation is based in Iksan, Jeollabuk-do Province with an office in Seoul and manufacturing plant in Ochang, Chungcheongbuk-do Province, South Korea. The company was incorporated in 2000.
Headquarters
3/F 543 Nonhyeon-ro, Gangnam-gu Seoul, Seoul, 06126
Seoul; Seoul;
Postal Code: 06126
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