China Wafer Level CSP Co., Ltd. is primarily engaged in supplying wafer-level chip size packaging technology and test services for the digital imaging and small form factor markets worldwide. The company offers services, such as TEI-CIS, hermetic, compliant bumping, solder bumping, and interposer-LED; qualification services for new products; and various co-design services to semiconductor manufacturers, design houses, and module makers, which enable them to integrate the wafer-level chip size packaging into their wafer product. The company was incorporated in 2005 and is headquartered in Suzhou, China.
Headquarters
No. 29, Tinglan Lane, Industrial Park, Suzhou City, Jiangsu Province
Suzhou; Jiangsu;
Postal Code: 215026
Contact Details: Purchase the China Wafer Level Csp Co.,Ltd. report to view the information.
Website: http://www.wlcsp.com
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