PacTech USA Packaging specializes in packaging equipment manufacturing and wafer level packaging services, offering wafer level component assembly, various metallization finishes, and automated MEMS cantilever probe assembly solutions. PacTech USA Packaging provides WLP services across the globe and is engaged in a wide range of industry applications, including automotive, aerospace, consumer electronics, medical, and solar energy. They also offer subcontractor electroless nickel plating services and have been a main supplier for the production of solar cells in China since 2017. Their products allow for a high degree of precision and performance in advanced packaging applications.
Headquarters
No. 14, Medan Bayan Lepas, Technoplex, Phase 4, Bayan Lepas Industrial Zone
Bayan Lepas; Penang;
Postal Code: 11900
Contact Details: Purchase the Pactech Asia Sdn. Bhd. report to view the information.
Website: http://www.pactech.com
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