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Besi Apac Sdn. Bhd. (Malaysia)

Main Activities: Industrial Machinery Manufacturing
Full name: Besi Apac Sdn. Bhd. Profile Updated: August 31, 2024
Buy our report for this company USD 29.95 Most recent financial data: 2023 Available in: English Download a sample report

BE Semiconductor Industries N.V is a manufacturer of assembly equipment for the semiconductor industry. The company operates in the electronics, mobile internet, computing, automotive, industrial, LED, and solar energy markets, offering precision, reliability, and throughput at a low cost of ownership for semiconductor assembly equipment. Their target market includes semiconductor manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. has developed technology in high-precision and high-yield Die-to-Wafer Hybrid Bonding and offers a portfolio of advanced packaging solutions. They also provide tooling, conversion kits, spare parts, and other services for their installed base of customers. The company has a Process Technology and Engineering Department and is involved in the development of next-generation advanced packaging technologies.

Headquarters
No. 3, Jalan 26/7, Seksyen 26
Shah Alam; Selangor; Postal Code: 40400

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Website: http://www.besi.com

Basic Information
Outstanding Shares:
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Registered Capital:
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Financial Auditors:
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Incorporation Date:
October 31, 1990
Key Executives
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Director
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Director
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Director
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Director
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Director
Ownership Details
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100%
Company Performance
Financial values in the chart are available after Besi Apac Sdn. Bhd. report is purchased.
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Key Financial Highlights
Annual growth percentages for latest two years in local currency MYR. Absolute financial data is included in the purchased report.
Net sales revenue
-33.18%
Total operating revenue
-33.18%
Operating profit (EBIT)
5.31%
EBITDA
-9.86%
Net Profit (Loss) for the Period
4.37%
Total assets
13.8%
Total equity
12.03%
Operating Profit Margin (ROS)
1.51%
Net Profit Margin
1.09%
Return on Equity (ROE)
-0.78%
Quick Ratio
0.33%

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