BE Semiconductor Industries N.V is a manufacturer of assembly equipment for the semiconductor industry. The company operates in the electronics, mobile internet, computing, automotive, industrial, LED, and solar energy markets, offering precision, reliability, and throughput at a low cost of ownership for semiconductor assembly equipment. Their target market includes semiconductor manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. has developed technology in high-precision and high-yield Die-to-Wafer Hybrid Bonding and offers a portfolio of advanced packaging solutions. They also provide tooling, conversion kits, spare parts, and other services for their installed base of customers. The company has a Process Technology and Engineering Department and is involved in the development of next-generation advanced packaging technologies.
Headquarters
No. 3, Jalan 26/7, Seksyen 26
Shah Alam; Selangor;
Postal Code: 40400
Contact Details: Purchase the Besi Apac Sdn. Bhd. report to view the information.
Website: http://www.besi.com
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